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Technical Specifications: Dell Dimension L Series Reference

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Technical Specifications: Dell™ Dimension™ L Series Reference

Microprocessor Network
System Information Power
Expansion Bus Physical
Memory Environmental
Drives Regulatory Notices
Ports IRQ Assignments
Video Default Dell-Installed Expansion Card Placement
Audio

Microprocessor

Microprocessor type

Dimension Lxxxr

Intel� Pentium� III microprocessor that runs at 500, 550, or 600 MHz internally and 100 MHz externally, or a Pentium III processor that runs at 600, 667, 733, 800, 866, or 933 MHz, or 1 GHz internally and 133 MHz externally, or 1.1 GHz internally and 100 MHz externally

Dimension Lxxxcxe

Intel Celeron™ processor that runs at 700 or 800 MHz internally and 100 MHz externally 

Dimension Lxxxcx

Intel Celeron processor that runs at 433, 500, 533, 566, 600, 633, 667, 700, or 733 MHz internally and 66 MHz externally or 700 or 800 MHz internally and 100 MHz externally

Dimension Lxxxc

Intel Celeron processor that runs at 400, 433, 466, or 500 MHz internally and 66 MHz externally 
NOTE: Microprocessor offerings vary by country.
L1 cache 32-KB instruction and data cache
L2 cache

Pentium III processor

256-KB Advanced Transfer Cache that resides in the processor's core. The L2 cache runs at the processor's internal clock speed.

Celeron processor

128-KB SRAM
Microprocessor mounting socket 370
Math coprocessor internal to processor

System Information

System chip set

Dimension Lxxxr and Lxxxcx

Intel 810e chip set

Dimension Lxxxc and Lxxxcxe

Intel 810 chip set
Data bus width 64 bits
Address bus width 32 bits
DMA channels two 
Interrupt levels 15
System BIOS chip 4 Mb (512 KB)
System clock

Dimension Lxxxr

100 or 133 MHz (matches external processor speed)

Dimension Lxxxc, Lxxxcx, and Lxxxcxe

66 or 100 MHz (matches external processor speed)

Expansion Bus

Bus type PCI (version 2.2)
Bus speed 33 MHz
Expansion-card connectors supports four three-quarter-length PCI expansion cards
Expansion-card connector size 120 pins
Expansion-card connector data width (maximum) 32 bits

Memory

Architecture non-ECC SDRAM 168-pin modules
DIMM sockets two; gold contacts
DIMM capacities 32, 64, 128, 256, and 512 MB
Minimum RAM 32 MB (64 MB for systems running Microsoft� Windows NT�)1
Maximum RAM 512 MB
Frequency 100 MHz
Clock cycle 10 ns (supports four clocks only)
CAS latency three
SPD revision 1.2
Buffering unbuffered
Voltage 3.3 V
Data bus width 64 bits
BIOS address F0000h
1 Video memory uses 1 or 2 MB of system memory (RAM). Total RAM reported is 1 or 2 MB less than RAM installed.

Drives

Externally accessible one 5.25-inch bay and two 3.5-inch bays
Internally accessible one bay for 1-inch-high EIDE hard-disk drive

Ports

Externally accessible

Serial (DTE)

9-pin connector; 16550C-compatible

Parallel

25-hole connector (bidirectional)

Video

15-hole connector

PS/2-style keyboard

6-pin mini-DIN connector

PS/2-compatible mouse

6-pin mini-DIN connector

MIDI/game2

one 15-pin connector

USB

two USB-compliant connectors

Audio2

three miniature jacks for line in, line out, and microphone

Network2

RJ45 jack
Internally accessible

Primary EIDE

40-pin connector on PCI bus

Secondary EIDE

40-pin connector on PCI bus

Diskette drive

34-pin connector
2 Present only on systems with integrated audio and network capabilities.

Video

Video controller

Dimension Lxxxr and Lxxxcx

Intel 810e chip set with Dynamic Video Memory and 4-MB display cache memory

Dimension Lxxxcxe

Intel 810 chip set with Dynamic Video Memory

Dimension Lxxx

Intel 810 chip set with Dynamic Video Memory and 4-MB display cache memory

Audio

Audio controller2 Creative Sound Blaster Audio PCI chip with 64-voice wavetable synthesis
2 Present only on systems with integrated audio and network capabilities.

Network

NIC2 Intel Pro 10/100-Mbps 82559 chip
2 Present only on systems with integrated audio and network capabilities.

Power

DC power supply

Wattage

145 W

Heat dissipation

700 BTU (fully loaded system without monitor)

Voltage (switch selectable on back panel)

90 to 135 V at 60 Hz;
180 to 265 V at 50 Hz;
100 V at 50 to 60 Hz for Japanese systems
Backup battery 3-V CR2032 coin cell

Physical

Height 39 cm (15.375 inches)
Width 16.8 cm (6.625 inches)
Depth 34 cm (13.375 inches)
Weight 9.9 kg (22 lb)

Environmental

Temperature

Operating

10� to 35�C (50� to 95�F)3

Storage

–40� to 65�C (–40� to 149�F)
Relative humidity 20% to 80% (noncondensing)
Maximum vibration

Operating

0.25 G at 3 to 200 Hz at 1/2 octave/min

Storage

0.5 G at 3 to 200 Hz at 1/2 octave/min
Maximum shock

Operating

bottom half-sine pulse with a change in velocity of 50.8 cm/sec (20 inches/sec)

Storage

27-G faired-square wave with a velocity change of 508 cm/sec (200 inches/sec)
Altitude

Operating

–15.2 to 3048 m (–50 to 10,000 ft)3

Storage

–15.2 to 10,668 m (–50 to 35,000 ft)
3 At 35�C (95�F), the maximum operating altitude is 914 m (3000 ft).

Regulatory Notices

FCC (U.S. only) Class B
IC Notice (Canada only) Class B
CE Notice Class B
VCCI Notice (Japan only) Class B
NOM O24 Information (Mexico only)

IRQ Assignments

IRQ Line System Resource IRQ Line System Resource
IRQ0 System timer IRQ8 RTC
IRQ1 Keyboard buffer IRQ9 Available
IRQ2 Enables IRQ8 through IRQ15 IRQ10 Available
IRQ3 Available4 IRQ11 Available
IRQ4 Serial port IRQ12 Mouse port
IRQ5 Available IRQ13 Math coprocessor
IRQ6 Diskette/tape drive controller IRQ14 Primary EIDE channel
IRQ7 Parallel port IRQ15 Secondary EIDE channel
4 IRQ3 is available provided that no other device in the computer (such as a modem) is using COM2 or COM4.

Default Dell-Installed Expansion Card Placement

Expansion-Card Slot Expansion Card
PCI Slot 1 Open
PCI Slot 2 Audio
PCI Slot 3 NIC
PCI Slot 4 Modem

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