Specifications: Dell™
Dimension™ XPS Rxxx Systems
General | System Information |
Expansion Bus | Memory | Drives | Ports | Audio | Video | Power | Physical | Environmental | Regulatory Notices
|
| Microprocessor type |
Intel� Pentium� II with MMX™ technology |
| Microprocessor speeds |
350 MHz internal/100 MHz external
400 MHz internal/100 MHz external
450 MHz internal/100 MHz external |
| L1 cache |
32 KB |
| L2 cache |
512 KB |
| Microprocessor mounting |
single-edge contact (SEC) cartridge connected to the system
board contains microprocessor and cache circuitry |
| Math coprocessor |
internal to microprocessor |
|
| System chip set |
Intel 440BX AGPset |
| Data bus width |
64 bits |
| Address bus width |
32 bits |
| DMA channels |
7 |
| Interrupt levels |
15 |
| System BIOS chip |
2 Mb (256 KB) |
| System clock |
100 MHz (matches external processor speed) |
| Diskette/communications ports |
48 MHz from the system clock |
|
| Bus types |
ISA, PCI, and AGP |
| ISA expansion-card connectors |
1 full-length |
| PCI expansion-card connectors |
3 full-length |
| AGP expansion-card connector |
1 full-length |
| Shared expansion-card slots |
1 full-length (slot contains both an ISA and a PCI connector, only one of which can be
used at any given time) |
| ISA bus frequency |
8.33 MHz |
| PCI bus frequency |
33 MHz |
| AGP bus frequency |
66 or 133 MHz (based on video card) |
| Plug and Play revision |
1.2a |
| PCI bus specification |
complies with PCI specification 2.1 |
| PCI-to-PCI bridging |
supported |
|
| Architecture |
ECC or non-ECC SDRAM modules (To support ECC, all installed
DIMMs must be ECC-capable.) |
| DIMM sockets |
3 |
| DIMM capacities |
32, 64, and 128 MB |
| Minimum RAM |
64 MB (non-ECC) |
| Maximum RAM |
384 MB |
| Frequency |
100 MHz |
| Clock cycle |
10 ns (supports 4 clocks only) |
| CAS latency |
3 |
| SPD revision |
1.2 |
| Buffering |
unbuffered |
| Voltage |
3.3 V |
| Data bus width |
8 bits |
| BIOS address |
F0000h |
 |
NOTE: Only 100-MHz DIMMs are supported. The system can
include both ECC and non-ECC memory; however, to support ECC, all installed DIMMs must be
ECC-capable. ECC DIMMs have 9 memory chips on the module and non-ECC DIMMs have 8 chips. |
|
|
| Mini tower chassis: |
|
Externally accessible bays
|
5 total: (2) 5.25-inch bays for diskette, tape, or CD-ROM
drives; (3) 3.5-inch bays for diskette or tape drives |
Internally accessible bays
|
2 bays for 1-inch-high EIDE or SCSI hard-disk drives |
| Desktop chassis (available only in certain locations): |
|
Externally accessible bays
|
4 total: (2) 5.25-inch for diskette, tape, or CD-ROM drives;
(2) 3.5-inch bays for diskette or tape drives |
Internally accessible bays
|
2 bays for 1-inch-high EIDE or SCSI hard-disk drives |
|
| Externally accessible: |
|
Serial (DTE)
|
9-pin connector; 16550C-compatible |
Parallel
|
25-hole connector (bidirectional) |
PS/2-style keyboard
|
6-pin mini-DIN connector |
PS/2-compatible mouse
|
6-pin mini-DIN connector |
MIDI/game*
|
15-pin connector |
Video
|
15-hole connector on an AGP video card |
Audio*
|
3 miniature jacks for LINE IN, LINE OUT, and MIC IN |
USB
|
2 USB-compliant connectors |
| Internally accessible: |
|
Primary EIDE
|
40-pin connector on PCI local bus |
Secondary EIDE
|
40-pin connector on PCI local bus |
Diskette drive
|
34-pin connector |
| * Available in on-board audio systems only |
|
| Model |
Crystal Semiconductor |
| Chip set |
CS4236 |
| Jacks: |
|
Audio line-in
|
one miniature audio jack |
Audio line-out
|
one miniature audio jack
(amplified) |
Microphone
|
one miniature audio jack |
|
| Video |
AGP video card (see manufacturer's specifications for
information about the card and any utilities and drivers included) |
|
| DC power supply: |
|
Wattage
|
200 W |
Voltage
|
90 to 135 V at 60 Hz;
180 to 265 V at 50 Hz |
Heat dissipation
|
778 BTU (fully loaded system without monitor) |
| Battery |
3-V CR2032 coin cell |
|
| Mini tower chassis: |
|
Height
|
43.69 cm (17.2 inches) |
Width (with base)
|
20.32 cm (8 inches) |
Depth
|
44.45 cm (17.5 inches) |
Weight
|
11.3 to 13.6 kg (25.0 to 30.0 lb) |
| Desktop chassis: |
|
Height
|
16.00 cm (6.3 inches) |
Width
|
42.42 cm (16.7 inches) |
Depth
|
44.45 cm (17.5 inches) |
Weight
|
11.3 to 13.6 kg (25.0 to 30.0 lb) |
|
| Temperature: |
|
Operating
|
10� to 35�C* (50� to 95�F) |
Storage
|
–40� to 65�C (–40� to 149�F) |
| Relative humidity |
20% to 80% (noncondensing) |
| Maximum vibration: |
|
Operating
|
0.25 G at 3 to 200 Hz at 1/2 octave/min |
Storage
|
0.5 G at 3 to 200 Hz at 1/2 octave/min |
| Maximum shock: |
|
Operating
|
left side (for mini tower orientation) and bottom half-sine
pulse with a change in velocity of 50.8 cm (20 inches)/sec |
Storage
|
23-G faired-square wave with a velocity change of 508.0 cm
(200 inches)/sec |
| Altitude: |
|
Operating
|
–16 to 3048 m* (–50 to 10,000 ft) |
Storage
|
–16 to 10,600 m (–50 to 35,000 ft) |
| * At 35�C (95�F), the maximum operating altitude is 914 m (3000 ft). |
|
| FCC (U.S. only) |
Class B |
| IC Notice (Canada only) |
Class B |
| CE Notice |
Class B |
| VCCI Notice (Japan only) |
Class B |
| NOM O24 Information (Mexico only) |
|
|
